Wishlist
EMERGE

Third Call for Proposals

Deadline: 31st December 2022, 23:59:59 CET

Emerging Printed Electronics Research Infrastructure

Free-of-charge access for research & technology organizations, industry and small-medium enterprises to develop projects on sustainable flexible large-area printed electronics and photonics.

APPLY

EMERGE Third Call for Proposals

Deadline: 31st December 2022, 23:59:59 CET

The EMERGE consortium, composed by 11 top-ranked European partners, opens the 3rd call for proposals on flexible large-area printed electronics and photonics (deadline 31st December 2022, 23:59:59 CET).

Applicants from academia and industry are invited to apply to gain free access to develop projects related to any of the 4 groups of transnational access activities envisaged by EMERGE:

  • TA1: Modelling, simulation and design of materials, devices and systems
    Access to design, modelling and simulation facilities will address projects oriented on high-resolution multiscale process simulations, as well as machine learning artificial intelligence based approaches giving insight and guidelines for novel material growth, functional design, and fabrication.
  • TA2: Material synthesis and ink formulation
    Access to materials synthesis and characterization facilities will be devoted to faster, cheaper and more sustainable ink/ pastes formulation with improved quality control dedicated to specific application scopes.
  • TA3: Prototype fabrication
    Access to prototypes fabrication facilities will focus on highly efficient production of sophisticated and complex flexible large-area printed electronics and photonics systems with high conformability and integrability dedicated to specific application needs allowing upscaling and technology transfer processes towards industrial production.
  • TA4: Characterization of prototypes and demonstrators
    Access to demonstrators’ test, validation and characterization aims to establish performance and stability tests under industrial protocols in simulated and real conditions for various types of devices using a wide variety of available characterization methods aiming at specifying universal metrology protocols. Besides, it will offer solutions on encapsulation processes and investigations of ageing processes while developing automated testing setups to accelerate device evaluation.

Tools available within TA1-4 can be found in the section “Services & Infrastructures”.

Proposals can be submitted through the EMERGE website, section “proposal submission”. Please check our “user guidelines” for all the information regarding access rules to EMERGE network, proposal submission and evaluation.