Equipment: Besi Data Con 2200 Evo
Technique: Pick and place machine
Contact person (RISE): Yusuf Mulla (yusuf.mulla@ri.se)
Responsible: Anurak Sawatdee (anurak.sawatdee@ri.se)
Description: Equipment for surface mounting device, SMD. Mount components on the printed circuit board. The pick head can apply both heat and pressure.
Specifications:
- Accuracy: ±10 µm;
- High productivity;
- Up to 4 working heads;
- Single pass production for complex products;
- Die attach, flip chip, multi-chip capability;
- Epoxy writing & stamping, flux dipping;
- Die pick from wafer, waffle pack, gel pack, feeder;
- Die place to carrier, boat, substrate, lead frame, wafer;
- Hot and cold processes supported: epoxy, soldering, thermo-compression;
- MCM, SIP, hybrids.
