TA3.1. Device Preparation

Plotter that uses a knife to cut materials such as paper and plastic films for e.g. prototype or sample preparation purposes.

The equipment is used to cut or engrave materials such as wood, metal, and polymer.

Manual pick and place station and equipment for surface mounting of devices. 

Equipment for surface mounting device, SMD. Mount components on the printed circuit board. The pick head can apply both heat and pressure.