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About
Project overview
Main objectives
Vision, mission and uniqueness
Impact
Emerge activities
Consortium
Services & infrastructures
Apply for innovation
Proposal submission guidelines
User guidelines
Calls
1st Call for Proposals
2nd Call for Proposals
3rd Call for Proposals
4th Call for Proposals
5th Call for Proposals
6th Call for Proposals
9th Call for Proposals
Proposal submission
Evaluation panel
Results
Success stories
Publications
Deliverables
Promotional Materials
News & Events
Contacts
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Back to Services & Infrastructure
TA3.1. Device Preparation
Transnational Access Activity
TA1. Theory: Modelling, simulation, and design of materials, devices and systems
TA1.1. Device design and architectures
TA1.2. Modelling & simulation
TA2. Material synthesis and ink formulation
TA2.1. Materials characterization
TA2.2. Chemical & physical techniques
TA3. Prototype fabrication
TA3.1. Device Preparation
TA3.2. Functional 2D & 3D printing
TA3.3. Industrial printing
TA3.4. Nanoimprinting & laser patterning
TA3.5. Vacuum assisted deposition
TA4. Characterization of prototypes and demonstrators
TA4.1. Device metrology & characterization
TA4.2. Validation and standardization
Countries/Institutes
Countries/Institutes
Austria
Joanneum Research (JOR)
Materials Center Leoben (MCL)
Germany
Helmholtz Institute Erlangen-Nürnberg (HI ERN)
Technische Universität Dresden (TUD)
Greece
Ethniko Kentro Erevnas Kai Technologikis Anaptyxis (CERTH)
Hellenic Mediterranean University (HMU)
Poland
Warsaw University of Technology (WUT)
Portugal
ALMASCIENCE (ALMA)
Instituto de Desenvolvimento de Novas Tecnologias (UNINOVA)
Spain
Institut Català de Nanociència I Nanotecnologia (ICN2)
Sweden
Research Institute of Sweden (RISE)
More +
Plotter cutter: Graphtec Cutting pro FC2250-60
Plotter that uses a knife to cut materials such as paper and plastic films for e.g. prototype or sample preparation purposes.
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Laser cutter: Trotec Speedy 300FLEXX
The equipment is used to cut or engrave materials such as wood, metal, and polymer.
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Manual device mounting
Manual pick and place station and equipment for surface mounting of devices.
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Pick and place machine: Besi Data Con 2200 Evo
Equipment for surface mounting device, SMD. Mount components on the printed circuit board. The pick head can apply both heat and pressure.
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