Equipment: XYZTec, Sigma Conder Bondtester
Technique: Static mechanical tests
Description:
Different mechanical load possibilities like 3- and 4-point bending applications, pull, peel and shear tests for the evaluation of the mechanical properties for different material groups including substrates for printed electronics. Additional opportunities are the coupling with in-situ analytical possibilities e.g. electrical equipment like power units. Also the usage of a DIC (digital image correlation) system for local strain distribution is available.
Specifications:
- Axis (x,y,z) speed 50 mm/s
- Resolution: 30 nm
- Force 1 to 10³ N (± 0.075%)