Equipment: General Electric, nanotom
Technique: Wire bonding for chip, sensor interconnects
Description:
Ball-wedge bonding for 25 µm Au and Al wire connections for chips, sensors interconnections.
Specifications:
- Programmable linear Z-axis with 60mm stroke
- Programmable linear Y-axis with 25mm stroke
- Standard working height: 55 mm
- 90° wire guide
- Heating up to 250°C