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Transnational Access Activity/Installation
TA4. Characterization of prototypes and demonstrators

Equipment: General Electric, nanotom

Technique: Wire bonding for chip, sensor interconnects

Description:

Ball-wedge bonding for 25 µm Au and Al wire connections for chips, sensors interconnections.

Specifications:

  • Programmable linear Z-axis with 60mm stroke
  • Programmable linear Y-axis with 25mm stroke
  • Standard working height: 55 mm
  • 90° wire guide
  • Heating up to 250°C