SUSS MicroTec – Substrate Conformal Imprint Lithography (SCIL)

SUSS MicroTec – Substrate Conformal Imprint Lithography (SCIL)
Transnational Access Activity/Installation
TA3. Prototype fabrication • TA3.4. Nanoimprinting & laser patterning

Equipment: SUSS MicroTec  – Substrate Conformal Imprint Lithography (SCIL)
Technique: Nanoimprint lithography
Acquisition year: 2018
Responsible: Diana Gaspar /

Description: SCIL technology is particularly suitable for high demand imprint processes. Here a soft stamp is used in combination with a hard but flexible glass carrier, thereby achieving superior evenness of contact and exceptionally high fidelity in pattern transfer. SCIL technology is suited for all highly demanding processes where a high-quality etching mask is employed, such as the production of optical elements as well as in the production of TFTs.


  • Soft stamp on glass backplate (flexible stamp)
  • Chuck for 4” wafers with wafer thickness compensation
  • Sequential stamp imprint and separation from resist
  • Automated process (manual tunning possible for specific application needs)
  • Good residual layer control
  • High resolution (40 nm line patterns tested) and high uniformity in 4” wafer
  • Low-pressure imprint
  • PDMS stamp manufacturing toolset from rigid masters

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