Equipment: Fine Placer Pico
Technique: Assembly of electronic components and material testing
Contact person (Warsaw University of Technology): Jakub Krzemiński (Jakub.firstname.lastname@example.org)
Responsible: Jerzy Szalapak(Jerzy.Szalapak@pw.edu.pl)
Description: The manual device is used to assemble electronics components. The system is equipped with a heating table and heated nozzle.
- assemble smd components.
- assemble force up to 0,5 kg.
- heating table up to 300 0C.