Assembly station of electronic components: Fine Placer Pico

Equipment: Fine Placer Pico
Technique: Assembly of electronic components and material testing
Contact person (Warsaw University of Technology): Jakub Krzemiński (Jakub.krzeminski@pw.edu.pl)
Responsible: Jerzy Szalapak(Jerzy.Szalapak@pw.edu.pl) 

Description: The manual device is used to assemble electronics components. The system is equipped with a heating table and heated nozzle. 

Specifications: 

• assemble smd components.
• assemble force up to 0,5 kg.
• heating table up to 300 ⁰C.