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Equipment: Fine Placer Pico
Technique: Assembly of electronic components and material testing.
Responsible: Jerzy Szałapak/ 
Jakub Krzemiński /

Description: The manual device is used to assemble electronics components. The system is equipped with a heating table and heated nozzle. 

Specifications: 

  • assemble smd components.
  • assemble force up to 0,5 kg.
  • heating table up to 300 0C.