Equipment: Fine Placer Pico
Technique: Assembly of electronic components and material testing.
Responsible: Jerzy Szałapak/
Jakub Krzemiński /
Description: The manual device is used to assemble electronics components. The system is equipped with a heating table and heated nozzle.
Specifications:
- assemble smd components.
- assemble force up to 0,5 kg.
- heating table up to 300 0C.
